GlobalFoundries plans $575M advanced packaging facility in New York
GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by up to $20M in aid from the State of New York and up to $75Min direct funding from the U.
GlobalFoundries Plans New York Advanced Packaging And Photonics Center
GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center.
US announces $1.4 bln support for next-generation semiconductor advanced packaging
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.
GlobalFoundries to expand New York fab — announces new $575 million advanced packaging and photonics facility
GlobalFoundries is investing around $575 million to construct an advanced packaging and silicon photonics facility at its Malta, New York site.
GlobalFoundries to establish new center for advanced packaging and testing
Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, will invest $575 million to create a new center for
GlobalFoundries to create center for advanced packaging, testing of chips in NY
GlobalFoundries (GFS) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New
GlobalFoundries expanding with first-of-its-kind advanced packaging center in New York
Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced packaging and testing.
Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.
TweakTown1h
NVIDIA ordering more CoWoS-L advanced packaging from TSMC: ready for more Blackwell AI GPUs
NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...
ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...
Federal funding boosts US chip packaging with $1.4B in CHIPS Act awards
The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...
Digi Times19h
US govt commits US$1.4 billion to domestic chip packaging
The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging ...
Semiconductor Engineering1d
Advanced Packaging: A Curse Or A Blessing For Trustworthiness?
The field of advanced packaging in particular is undergoing significant change, and this presents both opportunities and ...
Electronic Design1d
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.