Alpha and Omega Semiconductor Limited ("AOS") (Nasdaq: AOSL), today announced its participation in the following upcoming investo ...

Veeco Instruments says that a global Semiconductor IDM has qualified Veeco’s WaferStorm® and WaferEtch® platform for two new ...

• Intel Foundry offers system-level integration using Intel 14A on Intel 18A-PT, connected via Foveros Direct (3D stacking) ...

characterisation, integration and validation of compound semiconductor technology across four areas: power electronics, ...

IceGaN is a form of smart power HEMT that features advanced sensing and protection capabilities. According to Daniel Murphy, ...

The AI boom has ushered in unprecedented opportunities, but it has also created significant challenges in packaging, pricing and selling AI-driven products. As a product leader at an AI company ...

As adults consumes an average of 165 chocolate Easter eggs over the course of their adult life, it raises an environmental concern about the sheer amount of packaging waste generated. A recent ...

Abstract: Field-Stop Insulated Gate Bipolar Transistors (FS-IGBTs) are widely used in various power applications due to their low conduction and switching losses. However, further reductions in cell ...

This alliance merges SMX's invisible molecular marking and blockchain-based platform with Aegis Packaging's O₂X™ coating technology offering a seamless way to enhance the recyclability and ...

Researchers at Virginia Tech have found a way to make biodegradable packaging stronger while using less energy in the process. The research team from the College of Agriculture and Life Sciences ...

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of ...