To prepare for the future 3D integration ICs and systems, the 3D EC is identifying 3- to 5-year window killer applications and the common technical challenges they pose to smoothly extend 3D ...

In this article, we will explore the concept of 3D integration in VLSI circuits, its benefits, various techniques employed, advancements in technology, future trends, and a comparison between 2D and ...

The transportation sector is undergoing a significant transformation, primarily due to advancements in technology.

Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S. WEST LAFAYETTE, Ind. – Purdue University is working toward the future in microelectronic ...

Enterprise Application Integration (EAI) is the use of technologies and services across an enterprise to enable the integration of software applications and hardware systems. Many proprietary and ...