Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Unexpected change rewards those who are quick to adjust, but all aspects of a system must be adjusted to keep growth going.

Researchers from the University of Warwick and the National Research Council of Canada have engineered a strained germanium ...

AI chip that uses light instead of electrons to run generative models far faster and with drastically lower power consumption ...

A new Weibo post indicates that Apple plans to begin testing after the New Year, with mass production to start after the ...

China’s latest artificial intelligence leap was widely described as “impossible” until it arrived, rattling markets and ...

Chinese EUV Prototype Arrives Early. As computing techniques improved, more and more advanced chips were invented. The latest generation of 3nm and 2nm nodes is so small that the ...

Scientists at Ames National Laboratory, in collaboration with Indranil Das's group at the Saha Institute of Nuclear Physics ...

In Design Rewind, AD looks back at the people, places, and things that defined 2025, from ’90s nostalgia to the best place to ...

An all optical processor delivers extreme throughput and energy efficiency for generative AI, highlighting a new path beyond ...

From holiday shows to walking tours to winter celebrations — plus ideas for New Year's Eve — here's what's happening in the ...