By TES Electronic Solutions, with appreciated help from ChatGPT5.6, and Gemma4:31b ...

New IP delivers up to 32 Gbps per lane, deterministic latency, and scalable connectivity for next-generation waveband converter systems. Santa Clara, Calif.– Achronix Semiconductor Corporation, the ...

HSINCHU, Taiwan – United Microelectronics Corp (UMC) shares rose 6% after the company maintained its confidence in its AI foundry strategy despite a wider sector selloff affecting semiconductor stocks ...

SUNNYVALE, Calif. -- Synopsys, Inc. (Nasdaq: SNPS) today reported results for its third quarter of fiscal year 2026. Revenue for the third quarter of fiscal year 2026 was $2.477 billion, compared to ...

Artificial intelligence is rapidly reshaping cybersecurity. Much of the conversation has focused on how large language models are helping developers write code, but a more significant shift may be ...

SiFive today, at an event coinciding with Hot Chips, will introduce the SiFive BigSky SF-2U870 datacenter development platform. In collaboration with hyperscaler customers and leading ecosystem ...

PICs are unlocking faster wireless technologies like FSO, 6G, and ISAC, with real solutions already emerging for today’s biggest challenges. Wireless networks are under growing pressure to support ...

One of the key advantages and challenges of the RISC-V architecture is the ability to add custom instructions. Adding instructions to a RISC-V core can make a system more secure or boost performance ...

Korea’s ambition to develop next-generation semiconductors, physical artificial intelligence (AI) and data centers is running into a basic but formidable constraint: electricity.

TSMC’s difficulty stitching together AI accelerators with high-bandwidth memory (HBM) on a single chip gives Intel a chance to win foundry customers, according to Counterpoint Research co-founder Neil ...

The platform brings neuromorphic AI to Arduino-compatible embedded systems, with integrated tools for evaluating inference performance and power consumption. For eeNews Europe readers, the board ...

ISO 26262 Part 11 provides semiconductor-specific guidance to help architects make those decisions, while showing how modern SoC architecture and automation can reduce development risk. ISO 26262 Part ...