Kaiserslautern, Germany, January 14, 2025 - Creonic GmbH, the leading provider of cutting-edge communications IP cores, ...

The next-generation UCIe physical layer IP, based on TSMC's N4 process, is expected to finalize its design later this year, ...

This milestone marks a significant achievement in ensuring seamless integration and reliable data transfer between the two ...

YorChip, Inc. and Chipcraft announce development of a low cost, low power 8 bit 200Ms/s ADC Chiplet. Currently no ultra-low ...

Ceva today announced that its award-winning Ceva-NeuPro-Nano Embedded AI NPUs have gained significant traction in the AIoT ...

From seatbelts and antilock brakes to airbags and electronic stability control, the automotive industry has introduced ...

The partnerships expand the embedded AI ecosystem for the Ceva-NeuPro-Nano NPU and include new collaborations with Cyberon ...

Lonquan 560 SoCs leverage Ceva-SensPro Vision AI DSP to advance ADAS capabilities amidst China's rapidly growing EV market ...

QUALITAS SEMICONDUCTOR, a leading provider of high-speed interconnect solutions, has announced the supply of its 4nm PCIe 6.0 ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet ...

The JESD204C standard enables establishing high-speed serial links between a Controller and ADC and DAC converters. JESD204C ...

Bestechnic integrates market leading Ceva-Waves Wi-Fi 6 IP together with Ceva-Waves Bluetooth Dual Mode IP in low power ...