Aries Electronics chose Wescon (Santa Clara, CA, April 12-14, www.wescon.com) to highlight a new test and burn-in socket as well as a new RF socket. The company's new test and burn-in socket ...

Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented, state-of-the-art ...

Ironwood Electronics has released a new socket for testing BGA devices like DDR4 memory chips. The SBT-BGA-7051 test socket features a floating guide for precise ball-to-pin alignment. Simply place ...

Smiths Interconnect is thrilled to announce that its DaVinci 112 high-speed test socket received the prestigious Best Test Measurement Award of the Year at the Global Electronics Achievement Awards ...

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...

The pogo-pin based ET 2300 socket system operates at frequencies up to 23 GHz with an insertion loss of -1 dB. It allows users to test and debug any BGA, QFN, or other custom packages with lead ...

MD&M West unites five powerful industry sectors—MedTech, Automation, Design & Manufacturing, Plastics, and Packaging—creating the West Coast's most comprehensive manufacturing event.

Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...