Corp. (SJ Semi), a major packaging and testing partner of Huawei's chip design arm HiSilicon, has received domestically ...

Apple is planning to overhaul its chip design for the 2026 iPhones, in a move that could mark the first time it uses advanced multi-chip packaging in a mobile device. It sounds complicated, but ...

The future of digital computing and communications will involve both electronics—manipulating data with electricity—and ...

BENGALURU: While many of us toss aside plastic packets after munching on chips or biscuits, a Bengaluru-based start-up, Unified Intelligence Private Limited, is transforming these multi-layered ...

Apple will reportedly use a more advanced SoIC packaging technology for its M5 chips, as part of a two-pronged strategy to meet its growing need for silicon that can power consumer Macs and ...